四、高速PCB設(shè)計(jì)知識(shí)(略)
五、建立元件庫(kù): 通孔焊盤的設(shè)計(jì): 1、定義:類型Through,中間層(fixed),鉆孔Drill/slot(圓形,內(nèi)壁鍍錫plated,尺寸) 2、層的定義:BEGIN Layer(Top)層:REGULAR-PAD < THERMAL-PAD = ANTI-PAD END LAYER(同BEGIN,常用copy begin layer, then paste it) TOP SOLDERMASK:只定義REGULAR-PAD ,大于(Begin layer層regular-pad,約為1.1~1.2倍) BOTTOM SOLDERMASK(同Top soldermask,常用Top soldermask, then paste it) 例1 //--------------------------------------------------------------------------------------- Padstack Name: PAD62SQ32D *Type: Through *Internal pads: Fixed *Units: MILS Decimal places: 4 Layer Name Geometry Width Height Offset (X/Y) Flash Name Shape Name ------------------------------------------------------------------------------------------------------------------ *BEGIN LAYER *REGULAR-PAD Square 62.0000 62.0000 0.0000/0.0000 *THERMAL-PAD Circle 90.0000 90.0000 0.0000/0.0000 *ANTI-PAD Circle 90.0000 90.0000 0.0000/0.0000 *END LAYER(同BEGIN,常用copy paste) DEFAULT INTERNAL(Not Defined ) *TOP SOLDERMASK *REGULAR-PAD Square *75.0000 75.0000 0.0000/0.0000 *BOTTOM SOLDER MASK *REGULAR-PAD Square *75.0000 75.0000 0.0000/0.0000 TOP PASTEMASK(Not Defined ) BOTTOM PASTEMASK(Not Defined ) TOP FILMMASK(Not Defined ) BOTTOM FILMMASK(Not Defined ) NCDRILL 32.0000 Circle-Drill Plated Tolerance: +0.0000/-0.0000 Offset: 0.0000/0.0000 DRILL SYMBOL Square 10.0000 10.0000 ---------------------------------------------- 表貼焊盤的設(shè)計(jì): 1、定義,類型single,中間層(option),鉆孔(圓形,內(nèi)壁鍍錫plated,尺寸一定為0) 2、層的定義:BEGIN Layer(Top)層:只定義REGULAR-PAD TOP SOLDERMASK:只定義REGULAR-PAD ,大于(Begin layer層regular-pad,約為1.1~1.2倍) 例2 ------------------------------------------------ Padstack Name: SMD86REC330 *Type: Single *Internal pads: Optional *Units: MILS Decimal places: 0 Layer Name Geometry Width Height Offset (X/Y) Flash Name Shape Name ------------------------------------------------------------------------------------------------------------------ *BEGIN LAYER *REGULAR-PAD Rectangle 86 330 0/0 THERMAL-PAD Not Defined ANTI-PAD Not Defined END LAYER(Not Defined ) DEFAULT INTERNAL(Not Defined ) *TOP SOLDERMASK *REGULAR-PAD Rectangle 100 360 0/0 BOTTOM SOLDERMASK(Not Defined ) TOP PASTEMASK(Not Defined ) BOTTOM PASTEMASK(Not Defined ) TOP FILMMASK(Not Defined ) BOTTOM FILMMASK(Not Defined ) NCDRILL(Not Defined ) DRILL SYMBOL Not Defined 0 0 ------------------------------------------ 手工建立元件(主要包含四項(xiàng):PIN;Geometry:SilkScreen/Assembly;Areas:Boundary/Height;RefDes:SilkScreen/Display) 注意:元件應(yīng)放置在坐標(biāo)中心位置,即(0,0) 1、File ew..package symbol 2、設(shè)定繪圖區(qū)域:SetupDrawing size...Drawing parameter... 3、添加pin:選擇padstack ,放置,右排時(shí)改變text offset(缺省為-100,改為100)置右邊 4、添加元件外形:(Geometery) *絲印層Silkscreen:AddLine(OptionActive:package geometery;subclass:silkscreen_top) *裝配外框Assembly:AddLine(OptionActive:package geometery;subclass:Assembly_top) 5、添加元件范圍和高度:(Areas) *元件范圍Boundary:SetupAreaspackage boundary....Add Line(OptionActive Class:Package geometry;subclass:Package_bound_top) *元件高度Height:SetupAreaspackage Height....Add Line(OptionActive Class:Package geometry;subclass:Package_bound_top) 6、添加封裝標(biāo)志:(RefDes)LayoutLabelsResDs...) *底片用封裝序號(hào)(ResDes For Artwork):Pin1附近(...RefDes:Silkscreen_Top) *擺放用封裝序號(hào)(ResDes For Placement):封裝中心附近(...RefDes:Display_Top) *封裝中心點(diǎn)(Body center):指定封裝中心位置(AddTextPackage Geometery:Boby_centre) 7、建立Symbol文件:FileCreate Symbol 利用向?qū)Ы?p>
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